Continental partners with Telechips for Smart Cockpit High-Performance Computers

Continental and Telechips are poised to showcase their Smart Cockpit solutions at the Consumer Electronics Show (CES) in Las Vegas from January 9-12, 2024.

Autocar Professional BureauBy Autocar Professional Bureau calendar 14 Dec 2023 Views icon4498 Views Share - Share to Facebook Share to Twitter Share to LinkedIn Share to Whatsapp
Continental partners with Telechips for Smart Cockpit High-Performance Computers

Continental and Korean semiconductor company Telechips have joined forces to collaborate on Smart Cockpit High-Performance Computers (HPCs). Telechips is supplying Continental with its Dolphin System on Chip (SoC) family, specifically adapted to Continental's Smart Cockpit HPCs' pre-integrated function set. This collaboration aims to achieve an optimal balance between system performance, cost efficiency, and reduced development time.

The newly added SoC from Telechips becomes the standard in Continental's Smart Cockpit HPC solutions, catering to typical cockpit setups with driver and central displays, as well as assistance systems with up to five cameras. The Smart Cockpit HPC is designed to provide a state-of-the-art user experience, extending beyond the premium segment.

Jean-François Tarabbia, Head of the Architecture and Networking business area at Continental, highlights the significant reduction in development effort and costs for automotive manufacturers through the collaboration with Telechips. This efficiency is expected to enable faster service delivery to customers, from order intake to series production within 18 months.

Continental's Smart Cockpit HPC solution combines the powerful processors of Telechips' Dolphin family with pre-integrated functions, offering an enhanced user experience. The collaboration aims to contribute to the evolution of Electrical/Electronic (E/E) Architecture and shape the future of mobility beyond the Smart Cockpit.

The Smart Cockpit HPC supports extensive functions, including visualisation of "Surround View" based on four cameras, providing a 360-degree view around the vehicle. This feature aids in scenarios such as parking, maneuvering at low speeds, and detecting pedestrians and vehicles in city traffic.

Telechips, now adopted as the standard for Continental's Smart Cockpit HPC solution, has recently achieved key international standards such as ISO26262, TISAX, and ASPICE.

Continental's Smart Cockpit HPC is set to be showcased at the Consumer Electronics Show (CES) in Las Vegas from January 9-12, 2024, with demonstrations of various Smart Cockpit solutions from Continental and Telechips. The collaboration emphasises strong partnerships for delivering a state-of-the-art user experience in automotive technology. Continental has also partnered with Google Cloud to integrate an innovative dialog system into the Smart Cockpit HPC, enhancing the driving experience with generative AI that compiles information to answer drivers' questions.

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