Infineon highlights future trends in e-bike user experience

In a rapidly transforming mobility landscape, electrification of two- and three-wheelers continues to gain significant momentum, particularly in India, where electric two-wheeler sales clocked 1.14 million units in CY2024, and registered a notable 33% year-on-year growth.

To explore the innovation journey within this segment, Autocar Professional in association with Infineon Technologies, hosted a virtual masterclass on the topic – ‘The Revolution of E-Bike User Experience.’

The session drew strong participation from industry professionals, OEMs, and EV startups, all keen to understand how technological evolution is shaping light electric vehicle (LEV) design and user interfaces. The hour-long masterclass featured YS Chiow, Marketing Director for Vehicle User Experience Applications at Infineon Technologies Asia Pacific.

Chiow's insightful presentation shed light on how Infineon is spearheading system-level solutions that are powering the next generation of e-mobility. He began by outlining Infineon’s comprehensive offerings for electric two- and three-wheelers, emphasising the company's deep focus on developing complete system solutions rather than just standalone components.

As per Infineon, these solutions seamlessly integrate power electronics, advanced sensor technology, microcontrollers, and security features to support a holistic approach to vehicle design. Infineon’s portfolio is engineered to address a broad range of functional blocks within LEVs - from motor control and power management to battery charging and battery management systems (BMS).

The aim, Chiow noted, is to enable smarter, more compact, and cost-effective designs that enhance the overall user experience while offering OEMs scalability and flexibility.

High-performance silicon solutions

As per Chiow, one of the standout features of Infineon's solution set is the robustness of its silicon technology. Chiow highlighted that Infineon offers some of the most reliable silicon solutions available in the market today, designed to perform across both low and high-power density applications.

According to Chiow, Infineon’s products are developed with an industry-leading figure of merit (FOM), enabling designers to build rugged, reliable systems while reducing bill of materials (BOM) counts. Furthermore, Infineon’s range includes simplified, and space-efficient designs at competitive price points — a combination that is particularly attractive in price-sensitive markets like India and Southeast Asia.

As per the technology giant, it also sets itself apart with its stringent application-based qualification procedures, going beyond JEDEC standards to meet the higher demands of industrial and automotive use cases. This ensures a longer lifecycle and greater durability, especially in challenging environments where electric two- and three-wheelers often operate.

Innovation through integration

With LEVs evolving rapidly, integration is key to achieving next-level performance and user convenience. Infineon’s solutions offer multiple levels of integration, helping OEMs meet critical size, weight, and efficiency targets. Chiow pointed to real-world examples where integration of Infineon’s components has led to tangible design advantages - from smoother motor control to faster charging and better thermal management.

He emphasised that Infineon’s modular system approach allows OEMs to cherry-pick or fully adopt complementary technologies — including gate driver ICs, controllers, and power switches — that work together seamlessly to reduce complexity and accelerate development timelines.

Infineon’s competitive edge in LEVs

In his presentation, Chiow detailed why Infineon is the partner of choice for LEV projects across the globe. The company’s leadership in power technologies, including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), puts it at the forefront of energy efficiency and performance optimization.

Infineon also claims to have the industry’s most comprehensive packaging portfolio for Si MOSFET technologies, catering to a wide array of design preferences - from through-hole (THT) to surface-mount (SMD) applications.

Chiow underlined the importance of Infineon's deep application and manufacturing expertise, which spans the entire supply chain. The company ensures high-volume, high-quality component availability that enables OEMs to scale production quickly and confidently - an increasingly critical factor as demand for LEVs surges globally.

Another key differentiator, as Chiow pointed out, is Infineon’s commitment to supporting customers through a global network of field application engineers and trusted distributors. This ensures that OEMs and tier-1 suppliers receive hands-on, localised support during the entire product lifecycle - from concept to production.